for p artial switching pfc integrated igbt and diode bridge rectifier SLA5222 SLA5222 - ds rev. 1.0 sanken electric co.,ltd. 1 mar. 25, 2 01 4 features ? SLA5222 incorporates igbt and diodes for bridge rectifier of partial switching pfc, and achieves board space reduction . ? low saturation voltage igbt ? low v f diode bridge rectifier ? cl ip l ead is adopted for inner lead - low i nductance - low r esistance - high p owe r d issipation - s moke generation and explosion are less likely to occur in case of destruction ? v ce -------------------------------- ---------------------- 600 v ? i c -------------------------------- ----------- 30 a ( t c = 100 c ) ? v ce(sat) -------------------------------- --------------- 1.3 v typ. ? t f -------------------------------- ------------------- 170 ns typ. applications for partial switching pfc ? air conditioner ? other smps package sla not to scale equivalent circuit absolute maximum ratings ? unless otherwise specified, t a = 25 c parameter symbol test conditions rating unit collector to emitter voltage v ces 600 v gate to emitter voltage v ge 3 0 v continuous collector current i c(dc) t c = 25 c 30 a pulsed collector current i c (pulse) *1 pw 1m s duty cycle 1 % 100 a maximum collector to emitter dv/dt dv/dt *2 t c 1 25 c refer to figure 1 5 v/ns diode peak reverse voltage v rm 600 v diode forward current i f 25 a diode peak surge forward current i fsm *3 pw 10ms, half sinewave, 1 shot 200 a diode i 2 t limiting value i 2 t *4 1 ms pw 10 ms 200 a 2 s maximum allowable power dissipation p t * 5 no. fin . all element operation 5 w all element operation 92 w isolation voltage v iso between f in and all pins 1500 vrms operating junction temperature t j 150 c storage temperature range t stg ? (1) (7) (1) (2) (3) (4) (7) (5) (6)
SLA5222 SLA5222 - ds rev. 1.0 sanken electric co.,ltd. 2 mar. 25, 2 01 4 thermal characteristics ? unless otherwise specified, t a = 25 c parameter symbol conditions m in . t yp . m ax . unit thermal resistance ( junction to ambien t ) j - a all element operation ? ? j - c all element operation ? ? j - c igbt igbt 1 element operation ? ? j - c di diode 1 element operation ? ? electrical characteristics ? unless otherwise specified, t a = 25 c parameter symbol test conditions m in . t yp . m ax . unit igbt collector to emitter breakdown voltage v (br) ce s i c = 100 a, v g e = 0 v 600 ? ? ce s v ce = 600 v, v g e = 0 v ? ? g e s v g e = 3 0 v ? ? g e ( th ) v ce = 10 v , i c = 1 m a 3 ? v ge( th ) v ce = 10v, i d = 1 ma ? ? ce ( sat ) v ge = 15 v , i c = 30 a ? v ge = 15 v , i c = 50 a ? ? i e s v ce = 20 v v g e = 0 v f = 1.0 mhz ? ? o e s ? ? r e s ? ? g v ce = 300 v i c = 30 a v ge = 15 v ? ? ge ? ? gc ? ? d(on) t c = 25 c refer to figure 1 ? ? r ? ? d(off) ? ? f ? ? d(on) t c = 125 c refer to figure 1 ? ? r ? ? d(off) ? ? f ? ? diode forward voltage drop v f i f = 12.5 a ? ? r v r = 600 v ? ? a
SLA5222 SLA5222 - ds rev. 1.0 sanken electric co.,ltd. 3 mar. 25, 2 01 4 test circuit s and waveform s (a) test circuit ( b ) waveform figure 1 test circuits and w aveforms of dv/dt and switching time test conditions v ce = 300 v i c = 50 a v ge = 15 v r g = 39 l= 100 h 15 v r g i c l clamp diode v ce v ge v ge v ce i c 10 % 90 % 90 % 10 % t d ( on ) t r t d ( off ) t f dv / dt 90 % 10 %
SLA5222 SLA5222 - ds rev. 1.0 sanken electric co.,ltd. 4 mar. 25, 2 01 4 performance curves ic - vce (typical) 0 20 40 60 80 100 0 1 2 3 4 5 vce v) ic (a) tc=25 15v vge=20v 10v 8v 7v 6v ic - vce (typical) 0 20 40 60 80 100 0 1 2 3 4 5 vce v) ic (a) tc=125 15v vge=20v 10v 8v 7v 6v vce(sat) - tc (typical) 0 1 2 3 -50 0 50 100 150 tc ) vce(sat) (v) vge=15v ic=100a 70a 10a 50a 30a ic - vge (typical) 0 20 40 60 80 100 0 5 10 15 vge v) ic (a) vce=5v tc=-40 25 25 capa - vce (typical) 10 100 1000 10000 0 10 20 30 40 50 vce(v) capacitance(pf) tc = 25 f=1mhz vge 0 v cies cres coes vce,vge - qg (typical) 0 10 20 30 40 0 20 40 60 80 qg (nc) vce (10v) , vge (v) vce vge tc=25 rl=6
SLA5222 SLA5222 - ds rev. 1.0 sanken electric co.,ltd. 5 mar. 25, 2 01 4 vce - vge (typical) 0 1 2 3 4 5 1 10 100 vge v) vce (v) tc=-40 ic=100a 50a 10a vce - vge (typical) 0 1 2 3 4 5 1 10 100 vge v) vce (v) tc=25 ic=100a 50a 10a vce - vge (typical) 0 1 2 3 4 5 1 10 100 vge v) vce (v) tc=125 ic=100a 50a 10a 10 100 1000 1 10 100 sw time (ns) ic (a) sw time - ic (typical) tc = 25 td(off) tf tr td(on) 10 100 1000 1 10 100 sw time (ns) ic (a) sw time - ic (typical) tc = 125 td(off) tf tr td(on)
SLA5222 SLA5222 - ds rev. 1.0 sanken electric co.,ltd. 6 mar. 25, 2 01 4 if - vf (typical) 0 20 40 60 80 100 0 1 2 3 vf v) if (a) 25 25 reverse bias aso 1 10 100 1000 1 10 100 1000 v ce [v] i c [a] tc = 25 tc = 125 igbt vge = 15 v rg = 39 1shot safe operating area 0.1 1 10 100 1000 1 10 100 1000 v ce [v] i c [a] ic(pulse) max igbt tc = 25 1shot 100 s 1ms 10 s 10 100 1000 1 10 100 sw time (ns) rg () sw time - rg (typical) tc = 25 td(on) tr td(off) tf 10 100 1000 1 10 100 sw time (ns) rg () sw time - rg (typical) tc =125 td(on) tr td(off) tf
SLA5222 SLA5222 - ds rev. 1.0 sanken electric co.,ltd. 7 mar. 25, 2 01 4 t c = 25 c v ce = 5 v 1 shot one diode t c = 25 c 1 shot transient thermal resistance of one diode (pulse width) transient thermal resistance of igbt (pulse width) pulse width (s) pulse width (s) transient thermal resistance - pulse width di 1.e-03 1.e-02 1.e-01 1.e+00 1.e+01 1.e+02 1.e-06 1.e-05 1.e-04 1.e-03 1.e-02 1.e-01 1.e+00 1.e+01 1.e+02 pt (sec) rth j-c (/w) di tc=25 1 1shot transient thermal resistance - pulse width 1.e-04 1.e-03 1.e-02 1.e-01 1.e+00 1.e+01 1.e-06 1.e-05 1.e-04 1.e-03 1.e-02 1.e-01 1.e+00 1.e+01 1.e+02 pw (sec) rth j-c (/w) igbt tc=25 vce5v 1 1shot
SLA5222 SLA5222 - ds rev. 1.0 sanken electric co.,ltd. 8 mar. 25, 2 01 4 p ackage outline sla (lf no. 821) notes: 1) dimension is in millimeters 2) pb - free. device composition compliant with the rohs directive marking diagram p a r t n u m b e r l o t n u m b e r y i s t h e l a s t d i g i t o f y e a r ( 0 t o 9 ) m i s t h e m o n t h ( 1 t o 9 , o , n o r d ) d d i s t h e d a t e ( t w o d i g i t o f 0 1 t o 3 1 ) s l a 5 2 2 2
SLA5222 SLA5222 - ds rev. 1.0 sanken electric co.,ltd. 9 mar. 25, 2 01 4 operating precautions in the case that you use sanken products or design your products by using sanken products, the reliability largely depends on the degree of derating to be made to the rated values. derating may be interpreted as a case that an operation range is set by derating the load from each rated value or surge voltage or noise is considered for derating in order to assure or improve th e reliability. in general, derating factors include electric stresses such as electric voltage, electric current, electric power etc., environmental stresses such as ambient temperature, humidity etc. and thermal stress caused due to self - heating of semiconductor products. for these stresses, instantaneous values, maximum values and minimum values must be taken into consideration. in addition, it should be noted that since power devices or ics including power devices have large self - heating value, th e degree of derating of junction temperature affects the reliability significantly. because reliability can be affected adversely by improper storage environments and handling methods, please observe the following cautions. cautions for storage ? ensure that storage conditions comply with the standard temperature (5 to 35c) and the standard relative humidity (around 40 to 75%) ; avoid storage locations that experience extreme changes in temperature or humidity. ? avoid locations where dust or harmful gases are present and avoid direct sunlight. ? reinspect for rust on leads and solderability of the products that have been stored for a long time. cautions for testing and handling when tests are carried out during inspection testing and other standard test perio ds, protect the products from power surges from the testing device, shorts between the product pins, and wrong connections. ensure all test parameters are within the ratings specified by sanken for the product s . remarks a bout using silicone grease with a h eatsink ? when silicone grease is used in mounting the product s on a heatsink, it shall be applied evenly and thinly. if more silicone grease than required is applied, it may produce excess stress. ? volatile - type silicone greases may crack after long periods of time, resulting in reduced heat radiation effect. silicone greases with low consistency (hard grease) may cause cracks in the mold resin when screwing the products to a heatsink. our recommended silicone greases for heat radiation purposes, which will n ot cause any adverse effect on the product life, are indicated below: type suppliers g746 shin - etsu chemical co., ltd. yg6260 momentive p erformance m aterials inc. sc102 dow corning toray co., ltd. cautions for mounting to a heatsink ? when the flatness around the screw hole is insufficient, such as when mounting the products to a heatsink that has an extruded (burred) screw hole, the product s can be damaged , even with a lower than recommended screw torque. for mounting the products, the mounting surface flatness should be 0.05mm or less. ? please select suitable screws for the product shape. do not use a flat - head machine screw because of the stress to the product s . self - tapping screw s are not recommended. when using self - tapping screws, the screw may enter the hole diagonally, not vertically, depending on the conditions of hole before threading or the work situation. that may stress the products and may cause failures. ? recommended s crew t orque : package recommended screw torque to - 220, to - 220f 0.490 to 0.686 n ? ? ? ? ? ? ? for tightening screws, if a tightening tool (such as a driver) hits the product s , the package may crack, and internal stress fractures may occur , which shorten the lifetime of the electrical element s and can cause catastrophic failure . tightening with an air driver makes a substantial impact. in addition, a screw torque higher than the set torque can be applied a nd the package may be damaged. therefore, an electric driver is recommended. when the package is tightened at two or more places, first pre - tighten with a lower torque at all places, then tighten with the specified torque . when using a power driver, torque control is mandatory. ? please pay special attention about the slack of the press mold. in case that the hole diameter of the heatsink is less
SLA5222 SLA5222 - ds rev. 1.0 sanken electric co.,ltd. 10 mar. 25, 2 01 4 than 4 mm, it may cause the resin crack at tightening. soldering ? when soldering the products, please be sure to mi nimize the working time, within the following limits: ? 260 5 c 10 1 s (flow, 2 times) ? 380 10 c 3 .5 0.5 s (soldering iron , 1 time ) ? soldering should be at a distance of at least 1.5 mm from the body of the products. electrostatic discharge ? when handling the products, the operator must be grounded. grounded wrist straps worn should have at least 1m of resistance from the operator to ground to prevent shock hazard, and it should be placed near the operator. ? workbenches where the products are handl ed should be grounded and be provided with conductive table and floor mats. ? when using measuring equipment such as a curve tracer, the equipment should be grounded. ? when soldering the products, the head of soldering irons or the solder bath must be grounde d in order to prevent leak voltages generated by them from being applied to the products. ? the products should always be stored and transported in sanken shipping containers or conductive containers, or be wrapped in aluminum foil. important notes ? the con tents in this document are subject to changes, for improvement and other purposes, without notice. make sure that this is the latest revision of the document before use. ? application and operation examples described in this document are quoted for the sole purpose of reference for the use of the products herein and sanken can assume no responsibility for any infringement of industrial property rights, intellectual property rights or any other rights of sanken or any third party which may result from its use. ? unless otherwise agreed in writing by sanken, sanken makes no warranties of any kind, whether express or implied, as to the products, including product merchantability, and fitness for a particular purpose and special environment, and the information, in cluding its accuracy, usefulness, and reliability, included in this document. ? although sanken undertakes to enhance the quality and reliability of its products, the occurrence of failure and defect of semiconductor products at a certain rate is inevitable. users of sanken products are requested to take, at their own risk, preventative measures including safety design of the equipment or systems against any possible injury, death, fires or damages to the society due to device failure or malfunction. ? sanken p roducts listed in this document are designed and intended for the use as components in general purpose electronic equipment or apparatus (home appliances, office equipment, telecommunication equipment, measuring equipment, etc.). when considering the use of sanken products in the applications where higher reliability is required (transportation equipment and its control systems, traffic signal control systems or equipment, fire/crime alarm systems, various safety devices, etc.), and whenever long life expe ctancy is required even in general purpose electronic equipment or apparatus, please contact your nearest sanken sales representative to discuss, prior to the use of the products herein. the use of sanken products without the written consent of sanken in t he applications where extremely high reliability is required (aerospace equipment, nuclear power control systems, life support systems, etc.) is strictly prohibited. ? when using the products specified herein by either (i) combining other products or materia ls therewith or (ii) physically, chemically or otherwise processing or treating the products, please duly consider all possible risks that may result from all such uses in advance and proceed therewith at your own responsibility. ? anti radioactive ray desig n is not considered for the products listed herein. ? sanken assumes no responsibility for any troubles, such as dropping products caused during transportation out of sankens distribution network. ? the contents in this document must not be transcribed or cop ied without sankens written consent.
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